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资料简介

Introduction

中央层为 FSTQZ?W 高纯白色不通明石英资料
，保留了其杰出的隔热机能；两侧为半导体级通明石英资料
，高温区使用躲避了乳白资料颗粒脱落的风险
，不变性更高；复合层熔融结合
，无空穴
，拥有杰出的冷热加工机能
，作为隔热和保温资料利用于晶圆造程中

。
通明层可凭据客户需要定造：FLH321、FLH321H、FLH621、FLH621H、F-HUV等

。

The middle layer is FSTQZ?W high purity opaque quartz material, which remains its excellent thermal insulation property.Both sides are semiconductor grade transparent quartz material, which can avoid the risk of opaque material particle falling off at high temperature usage and provide higher stability.The composite layers are fused together and void free, with excellent cold and hot processing properties. It is used as thermal insulation material in wafer fabrication process. The transparent layer can be customized according to customer requirements:FLH321, FLH321H, FLH621, FLH621H, F-HUV, etc.

Al

14.2

Ca

0.60

Mg

0.05

Cu

0.01

Fe

0.23

Ni

0.05

Mn

0.05

Li

0.44

K

0.25

Na

0.12

Zr

—

Ti

1.3

B

0.08

Co

—

总和

17.38